SAMSUNG
CONVECTION MICROWAVE

MC28M6055CK/SP
MC28M6055CK/SP

28 Litres
HotBlast(TM) Technology
HotBlast(TM) technology is a brand new way of cooking
As its name says; powerful hot air is blown
through multiple air-holes in the top directly
onto the food.
And just like oven cooking; food is cooked
quickly and evenly with a crispy outside;
but stays juicy inside.
Easy View(TM)

Price: S$388.00 S$439.00

Save: S$51.00

Specification


BRAND SAMSUNG
MODEL MC28M6055CK/SP
PRODUCT TYPE CONVECTION MICROWAVE
CAPACITY (L) 28L
WEIGHT (KG) 17.6
DIMENSIONS (Wx Hx D) 517 x 310 x 463 mm
WARRANTY  

Overview



New faster cooking

HOTBLAST™ technology is a new method that reduces cooking times significantly. Powerful hot air is blown through multiple air-holes directly onto food, so it’s cooked evenly with a crispy outside, but juicy inside*

New faster cooking

HOTBLAST™ technology is a new method that reduces cooking times significantly. Powerful hot air is blown through multiple air-holes directly onto food, so it’s cooked evenly with a crispy outside, but juicy inside*


Easy View™

EASYVIEW™ glass lets you check on your cooking without opening the door. Unlike conventional microwave ovens, a metal mesh in the glass provides much better visibility inside, but offers just as much protection.

 


Enjoy healthier fried food

SLIM FRY™ Enjoy healthier fried food without a deep fryer. SLIM FRY™ technology combines a grill with warm air circulation, so food is cooked crispy inside and out using only a touch of oil*. And no greasy pans or splatters!


Make yogurt anytime

Enjoy homemade cake, bread, pizza or yogurt anytime of the day with the Fermentation Function, which utilises advanced fermentation technology for proofing dough or making natural yoghurt, without extra appliances.


Easy clean interior

CERAMIC INSIDE™

The durable CERAMIC INSIDE™ is easy to keep clean and scratch-free. Its smooth surface can be cleaned without scrubbing and won’t discolour over time. It’s also highly rust and scratch-resistant, so it last longer.